Learn more

BRIGHTEK OPTOELECTRONIC CO LTD

Overview
  • Total Patents
    18
About

BRIGHTEK OPTOELECTRONIC CO LTD has a total of 18 patent applications. Its first patent ever was published in 2011. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors are ZHONG HUICAI, DT CIRCUIT TECHNOLOGY CO LTD and ANKOUDINOV ALEXEI.

Patent filings in countries

World map showing BRIGHTEK OPTOELECTRONIC CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 13
#2 China 4
#3 United States 1

Patent filings per year

Chart showing BRIGHTEK OPTOELECTRONIC CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Chen Yi Hsun 8
#2 Huang Chien Chung 8
#3 Huang Chien-Chung 6
#4 Liao Chi Wei 5
#5 Chen Yi-Hsun 5
#6 Liao Qiwei 4
#7 Li Hengyan 4
#8 Wang Xianming 4
#9 Huang Jianzhong 4
#10 Chen Yixun 4

Latest patents

Publication Filing date Title
TW201440256A LED package structure for preventing lateral light leakage and method of manufacturing the same
US2013320361A1 Multichip package structure for generating a symmetrical and uniform light-blending source
TW201431368A Image capture device having light projection
TW201411885A Method for spreading fluorescent particles
TW201411889A Method of package illuminant elecment
TW201403870A Light emitting diode element and manufacturing mathod thereof
TW201401563A Multichip package structure for generating a symmetrical and uniform light-mixing source
TW201351609A Multichip package structure for generating a symmetrical and uniform light-mixing source
TW201251127A Method for making LED package structure
CN102818139A Light-emitting diode module and arrangement method thereof
CN102810606A Manufacturing method for heat conducting structure
TW201250981A Light emitting diode module
TW201250875A Method for making package structure
CN102809137A Lamp heat radiation structure manufacturing method and lamp component manufacturing method
CN102810485A Manufacture method of chip package structure semi-finished product
TW201248798A Manufacturing method for heat-conductive structure
TW201248746A Method for making semi-finished chip package structure
TW201245623A Manufacturing method for lamp heat-dissipation structure and manufacturing method for lamp assembly