| # | Country | Total Patents | |
|---|---|---|---|
| #1 | Germany | 3 | |
| #2 | United Kingdom | 3 | |
| #3 | Italy | 3 | |
| #4 | United States | 2 | |
| #5 | Malaysia | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Tuck Cheong Mun | 5 |
| #2 | Keung Phuah Kian | 5 |
| #3 | Meng Chan Boon | 5 |
| #4 | Sin Lee Huan | 5 |
| #5 | Huat Lee Kock | 5 |
| #6 | Khor Lily | 4 |
| #7 | Hoo Ong King | 4 |
| #8 | Lee Kock Huat | 2 |
| #9 | Keng Liow Eng | 2 |
| #10 | Phuah Kian Keung | 2 |
| Publication | Filing date | Title |
|---|---|---|
| DE10154855A1 | Stress-free lead frame for semiconductor devices, has peripheral pad provided with several stress-relief modules | |
| US6482680B1 | Flip-chip on lead frame | |
| US6544817B2 | Method for sawing a moulded leadframe package | |
| MY126047A | A mould for an encapsulation apparatus and method for using the same. |