WO2019114407A1
|
|
Field effect transistor, method of fabricating field effect transistor, and electronic device
|
CN110072336A
|
|
The method for separating flexible base board and rigid conductive carrier
|
CN108335982A
|
|
A kind of production method of GaN base HEMT device
|
CN108376707A
|
|
A kind of enhanced HEMT device of GaN base and preparation method thereof
|
CN108376706A
|
|
A kind of GaN base HEMT device and its manufacturing method
|
CN108376703A
|
|
A kind of Ohm contact production method suitable for AlGaN/GaN devices
|
CN108376705A
|
|
Gallium nitride base power device of inverted structure with graphene heat dissipating layer and preparation method thereof
|
CN108288582A
|
|
A kind of wafer scale GaN device substrate transfer method
|
CN108258043A
|
|
A kind of enhanced MOS HEMT devices of GaN base and preparation method thereof
|
CN108364923A
|
|
Using the gallium nitride base power device and preparation method thereof of carbon nanotube microchannel heat sink
|
CN108365008A
|
|
Has the preparation method of p-type two-dimensional material grid enhancement type gallium nitride fieldtron
|
CN108305834A
|
|
A kind of preparation method of enhancement type gallium nitride fieldtron
|
CN108054209A
|
|
Field-effect transistor, the method and electronic device for manufacturing field-effect transistor
|
CN107994078A
|
|
Field-effect transistor, manufacture method and electronic device with source electrode coordination electrode
|