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BEIJING DOUBLINK SOLDERS CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    163,353
  • Filing trend
    ⇧ 100.0%
About

BEIJING DOUBLINK SOLDERS CO LTD has a total of 15 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets chemical engineering, semiconductors and materials and metallurgy are WUXI HUAYING MICROELECTRONIC TECHNOLOGY CO LTD, XI AN WEIZHENG ELECTRONIC SCIENCE & TECHNOLOGY CO LTD and JIANGSU UNION SEMICONDUCTOR CO LTD.

Patent filings in countries

World map showing BEIJING DOUBLINK SOLDERS CO LTDs patent filings in countries
# Country Total Patents
#1 China 15

Patent filings per year

Chart showing BEIJING DOUBLINK SOLDERS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Yan Ru 9
#2 Xiang Cuihua 7
#3 Zhang Limin 5
#4 Zhou Xiaoguang 5
#5 Su Hongfu 4
#6 Chen Biao 4
#7 Du Lianmin 3
#8 Zhang Fusheng 2
#9 Yu Jieli 2
#10 Liu Ying 1

Latest patents

Publication Filing date Title
CN111843804A Polishing device
CN110983421A Bonded copper wire electric washing device
CN110987907A Method for simultaneously measuring cerium content and lanthanum content in gold alloy by using plasma atomic emission spectrometry
CN109536678A A kind of equipment for producing bonding wire of annealing and after-combustion one
CN109530330A A kind of device and minimizing technology removing bonding wire spool and wire box surface mass
CN108160605A A kind of cleaning device of bonding wire spool wire box
CN106827472A A kind of device and method made of line box integration for bonding wire
CN105428335A Bonding wire
CN104593634A Chemical gold/palladium-plated bonding silver alloy wire and preparation method thereof
CN104561958A Gold-plated palladium solution for preparing chemical gold-plated palladium bonded silver alloy wire
CN103560120A Chemical method palladium plating copper bonding wire and preparing method thereof
CN103558209A Method for measuring arsenic content of gold through plasma atomic emission spectrometry
CN103556140A Palladium plating liquid for chemically preparing palladium-plated copper bonding wire
CN103590085A Surface treatment method of aluminum spool for bonding wire production
CN103122421A Preparation method of high-performance gold bonding wire for package