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CHIPBOND TECHNOLOGY CORP

Overview
  • Total Patents
    240
  • GoodIP Patent Rank
    12,053
  • Filing trend
    ⇧ 200.0%
About

CHIPBOND TECHNOLOGY CORP has a total of 240 patent applications. It increased the IP activity by 200.0%. Its first patent ever was published in 2001. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets semiconductors, audio-visual technology and electrical machinery and energy are HASHIMOTO NOBUAKI, ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECH CO LTD and YAMANO TAKAHARU.

Patent filings in countries

World map showing CHIPBOND TECHNOLOGY CORPs patent filings in countries

Patent filings per year

Chart showing CHIPBOND TECHNOLOGY CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hsieh Chin-Tang 32
#2 Shih Cheng-Hung 27
#3 Hsieh Chin Tang 19
#4 Shih Cheng Hung 18
#5 Kuo Chih-Ming 17
#6 Kuo Chih Ming 16
#7 Ho Lung Hua 13
#8 Lee Chun-Te 13
#9 Guo Zhiming 13
#10 Hsieh Yung-Wei 12

Latest patents

Publication Filing date Title
TWI715492B Circuit board
TWI712136B Flip chip interconnection and circuit substrate thereof
TWI713166B Chip package and circuit board thereof
TWI710288B Method and device for adhering heat sinks to a circuit board tape
TWI711347B Flip chip interconnection and circuit substrate thereof
TWI703903B Flexible circuit board
TWI710287B Circuit board having punching predetermined area and sheet obtained from the same
TWI711128B Tape film with hydrophobic thin layer for carrying chip and manufacturing method thereof
TWI705748B Double-sided flexible printed circuit board and layout structure thereof
TWI692278B Flexible circuit board
TWI701451B Measurement-assisted lead of flexible circuit board
CN112259461A Soft circuit substrate with coarsening solder mask layer and manufacturing method thereof
TWI690156B Surface acoustic wave device and method manufacturing the same
TWI686507B Flexible circuit board for carrying chip and manufacturing method thereof
CN111933530A Soft circuit substrate for bearing chip and manufacturing method thereof
TW202032800A Semiconductor structure having 3d inductor and manufacturing method thereof
TWI669262B Device for preventing deformation of restrictor plate of reel
TWI669794B Method and device for compression bonding of chip to substrate
TWI671921B Chip package and chip
TWI669801B Flexible substrate