|
FR3092213A1
|
|
series resonant power converter
|
|
FR3083324A1
|
|
ELECTRONIC COMPONENT DEVERMINING EQUIPMENT
|
|
FR3077825A1
|
|
METHOD FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID PHASE DEPOSITION
|
|
KR20190093629A
|
|
Pseudo-resonant buck-type converter with continuous high frequency voltage
|
|
US2018172504A1
|
|
3D imaging optoelectronic module
|
|
US2017372935A1
|
|
Method of collective fabrication of 3D electronic modules configured to operate at more than 1 GHz
|
|
FR3048123A1
|
|
METHOD FOR INTERCONNECTING CHIP ON CHIP MINIATURIZED FROM A 3D ELECTRONIC MODULE
|
|
EP3059763A1
|
|
Method for manufacturing a 3d electronic module with external interconnection leads
|
|
FR3038130A1
|
|
3D ELECTRONIC MODULE COMPRISING A STACK OF BALL CASES
|
|
FR3034253A1
|
|
ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND METHOD OF MANUFACTURING THE SAME
|
|
EP2610906A1
|
|
Method for collective production of 3D electronic modules comprising only valid PCBs
|
|
FR2974942A1
|
|
PROCESS FOR PRODUCING RECONSTITUTED PLATES WITH THE MAINTENANCE OF CHIPS DURING THEIR ENCAPSULATION
|
|
WO2010142804A1
|
|
Method for positioning chips during the production of a reconstituted wafer
|
|
KR20110134467A
|
|
Method for positioning chips during the production of a reconstituted board
|
|
US2011247210A1
|
|
Process for the wafer-scale fabrication of electronic modules for surface mounting
|
|
EP2053646A1
|
|
Method for vertical interconnection inside 3D electronic modules using vias
|
|
EP2126969A1
|
|
Method of interconnecting electronic wafers
|
|
WO2008022901A2
|
|
Process for the collective manufacturing of electronic 3d modules
|
|
US2008289174A1
|
|
Process for the collective fabrication of 3D electronic modules
|
|
WO2007063113A1
|
|
3d electronic module
|
