Learn more

ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTD

Overview
  • Total Patents
    44
  • GoodIP Patent Rank
    49,971
  • Filing trend
    ⇩ 100.0%
About

ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTD has a total of 44 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2007. It filed its patents most often in Taiwan, Republic of Korea and United States. Its main competitors in its focus markets semiconductors, audio-visual technology and basic communication technologies are PHOENIX PREC TECHNOLOGY CORP, RISING TECH CO LTD and DENKA AGSP KK.

Patent filings in countries

World map showing ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 15
#2 Republic of Korea 14
#3 United States 11
#4 China 3
#5 Japan 1

Patent filings per year

Chart showing ZHUHAI ADVANCED CHIP CARRIERS & ELECTRONIC SUBSTRATE SOLUTIONS TECHNOLOGIES CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Dror Hurwitz 32
#2 Huang Alex 22
#3 Hurwitz Dror 12
#4 Huang Alex Shi-Fu 10
#5 Alex Huang 4
#6 Eva Igner 1
#7 Benny Michaeli 1
#8 Shin Fu Alex Huang 1
#9 Shih-Fu Alex Huang 1
#10 Chen Xian-Ming 1

Latest patents

Publication Filing date Title
TW201828396A New terminal which can achieve low-cost, high-yield and more reliable interposer and multi-layer support structure
KR20160092459A Method for fabricating film bulk acoustic resonator filters
KR20150126767A Polymer frame for a chip, such that the frame comprises at least one via series with a capacitor
US2016197593A1 Method for fabricating film bulk acoustic resonator filters
US9374059B1 Film bulk acoustic resonator filter
TW201543776A Insert Frame Having Polymer Substrate And Manufacturing Method Of The Frame
US2015296617A1 Interposer frame with polymer matrix and methods of fabrication
US2015294896A1 Method for fabricating embedded chips
US2015279814A1 Embedded chips
US2015195912A1 Substrates With Ultra Fine Pitch Flip Chip Bumps
US2015043126A1 Thin film capacitors embedded in polymer dielectric
US2014363927A1 Terminations and couplings between chips and substrates
KR20140077090A Single layer coreless substrate
US2014102765A1 Method of fabrication, a multilayer electronic structure and structures in accordance with the method
TW200850099A Advanced coreless support structures and their fabrication