| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 6 | |
| #2 | United States | 5 | |
| #3 | China | 3 | |
| #4 | EPO (European Patent Office) | 3 | |
| #5 | Australia | 2 | |
| #6 | Republic of Korea | 2 | |
| #7 | Singapore | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Electrical machinery and energy | |
| #3 | Measurement | |
| #4 | Micro-structure and nano-technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Electric discharge tubes | |
| #3 | Measuring light | |
| #4 | Microstructural devices |
| # | Name | Total Patents |
|---|---|---|
| #1 | Lebouitz Kyle S | 17 |
| #2 | Springer David L | 8 |
| #3 | Migliuolo Michele | 5 |
| #4 | Lebouitz Kyle | 5 |
| #5 | Hinds Edward F | 4 |
| #6 | Karwacki Eugene Jr | 1 |
| #7 | Ketkar Suhas Narayan | 1 |
| #8 | Johnson Andrew David | 1 |
| #9 | Neumann John | 1 |
| Publication | Filing date | Title |
|---|---|---|
| WO2011068959A1 | High-selectivity etching system and method | |
| CN101336312A | Pulsed-continuous etching | |
| WO2007025039A2 | Pulsed etching cooling | |
| CN101128622A | Etching chamber with subchamber | |
| US6887337B2 | Apparatus for etching semiconductor samples and a source for providing a gas by sublimation thereto | |
| EP1203208A1 | Thermal isolation using vertical structures |