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WUHAN XINXIN SEMICONDUCTOR MFG CORP

Overview
  • Total Patents
    387
  • GoodIP Patent Rank
    3,852
  • Filing trend
    ⇧ 652.0%
About

WUHAN XINXIN SEMICONDUCTOR MFG CORP has a total of 387 patent applications. It increased the IP activity by 652.0%. Its first patent ever was published in 2017. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, computer technology and measurement are TAIWAN SEMICONDUCTOR MFG CO LTD, SEMICONDUCTOR MFG INT SHANGHAI CO LTD and SEMICONDUCTOR MFG INT BEIJING.

Patent filings in countries

World map showing WUHAN XINXIN SEMICONDUCTOR MFG CORPs patent filings in countries
# Country Total Patents
#1 China 387

Patent filings per year

Chart showing WUHAN XINXIN SEMICONDUCTOR MFG CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Li Yun 54
#2 Zhou Jun 47
#3 Hu Sheng 43
#4 Luo Qingwei 30
#5 Liu Tianjian 26
#6 Ye Guoliang 25
#7 Hu Xing 23
#8 Zhao Dongguang 20
#9 Xie Yan 18
#10 Zhang Chaoran 15

Latest patents

Publication Filing date Title
CN112231777A Monotonic counter and monotonic counting method thereof
CN112185807A Method for forming polycrystalline circle stacking structure
CN112201573A Multi-layer wafer bonding method
CN112201574A Multi-layer wafer bonding method
CN112151444A Matching design method of wafer, wafer bonding structure and chip bonding structure
CN112102862A Chip structure, data reading processing method and chip structure manufacturing method
CN112103304A Backside-illuminated sensor, manufacturing method thereof and layout structure
CN112201645A Overlay mark, overlay error measuring method of wafer and stacking method of wafer
CN112201572A Method for stacking multilayer wafers and system for stacking multilayer wafers
CN112071747A Wafer bonding method
CN112071746A Wafer bonding method
CN111816646A Storage packaging chip and signal processing method thereof
CN111816627A Storage packaging chip and pin multiplexing method thereof
CN112018084A Semiconductor test structure and failure analysis method of semiconductor device
CN112018020A Semiconductor machine and method for modifying same
CN111968955A Semiconductor device and method for manufacturing the same
CN111968954A Semiconductor device and method for manufacturing the same
CN112018002A Wafer bonding equipment and wafer bonding method
CN111933618A Wafer assembly with alignment mark, forming method thereof and wafer alignment method
CN111933617A Cutting channel structure, semiconductor substrate and manufacturing method thereof