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WEIFANG GOERTEK MICROELECTRONICS CO LTD

Overview
  • Total Patents
    49
  • GoodIP Patent Rank
    31,066
  • Filing trend
    ⇩ 50.0%
About

WEIFANG GOERTEK MICROELECTRONICS CO LTD has a total of 49 patent applications. It decreased the IP activity by 50.0%. Its first patent ever was published in 2015. It filed its patents most often in WIPO (World Intellectual Property Organization), China and EPO (European Patent Office). Its main competitors in its focus markets audio-visual technology, semiconductors and measurement are DEHE ALFONS, ZOELLIN JOCHEN and AUTHENTIC LTD.

Patent filings in countries

World map showing WEIFANG GOERTEK MICROELECTRONICS CO LTDs patent filings in countries

Patent filings per year

Chart showing WEIFANG GOERTEK MICROELECTRONICS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Fang Huabin 10
#2 Fu Bo 8
#3 Song Qinglin 7
#4 Wang Dexin 6
#5 Tian Dewen 6
#6 Zou Quanbo 5
#7 Li Xiangguang 4
#8 Lin Yujing 4
#9 Wang Wentao 3
#10 Cai Mengjin 3

Latest patents

Publication Filing date Title
CN111935621A Microphone structure and electronic equipment
CN112019986A MEMS microphone
CN112019985A Microphone structure and electronic equipment
CN112087698A MEMS microphone
CN111935939A Sealing structure, sealing method, sensor, and electronic device
CN111935917A Product glue filling auxiliary device and glue filling method
CN111915182A Microphone packaging method and device and computer storage medium
CN111816621A Waterproof pressure sensor and packaging method
CN111818409A Bone voiceprint sensor and electronic device
CN111785715A Chip assembly, chip packaging structure and electronic equipment
CN111289460A Gas concentration detection device, detection method thereof, control device and storage medium
WO2020253147A1 Shielding process for sip packaging
WO2020253148A1 Encapsulation method for circuit units
WO2021036084A1 Sensor assembly and wearable device
WO2020238139A1 Electromagnetic shielding structure and manufacturing method therefor, and electronic device
WO2020253146A1 Method for packaging chip
WO2020238138A1 Method for detecting coverage of intermetallic compound
EP3218938A1 Repairing method and manufacturing method of micro-led