Learn more

VIKING TECH CORP

Overview
  • Total Patents
    57
  • GoodIP Patent Rank
    74,155
About

VIKING TECH CORP has a total of 57 patent applications. Its first patent ever was published in 1999. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors, electrical machinery and energy and audio-visual technology are MINOWA KOA INC, WEI SHIH-LONG and SUMITOMO METAL SMI ELECTRONICS.

Patent filings in countries

World map showing VIKING TECH CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 27
#2 China 17
#3 United States 13

Patent filings per year

Chart showing VIKING TECH CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ho Chien-Hung 21
#2 Wei Shih-Long 17
#3 Hsiao Shen-Li 17
#4 Ho Chien Hung 12
#5 Hsiao Shen Li 10
#6 Wei Shih Long 10
#7 Lu Chi-Yu 8
#8 Kuo Chen-Shen 6
#9 Zeng Guan-Min 5
#10 Lee Chiu-Min 4

Latest patents

Publication Filing date Title
TWI707366B Resistor element
US10892071B1 Thin film resistor element
TWI705462B Thin film resistor element and manufacturing method thereof
TWI682407B Four-terminal resistor
TWI679657B Flexible resistor component and manufacturing method thereof
TWI667666B Resistor element
TW201611681A Micro-resistance structure with high bending strength, manufacturing method thereof
TW201605000A A ceramic substrate, a chip carrier, and a semiconductor chip package componet and the manufacturing method thereof
TW201541569A Electronic packaging structure and its ceramic substrate
TW201541583A A carrier and a package structure having the carrier
US2014167911A1 Resistor component
TW201422352A Method of forming substrate
TW201400647A Metal plating deposition method
TW201349972A A substrate conduction process method
TW201317131A A method for selective metallization on a ceramic substrate
TW201316870A A method for manufacturing a substrate having a conductive vias
TW201314972A Light emitting diode package structure and manufacturing method thereof
TW201310593A Metallographic Ceramic Plate Method
TW201236226A Manufacturing method of package unit
TW201236227A Packaged substrate and fabrication method thereof