| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 13 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Wei Andy | 13 |
| #2 | Kammler Thorsten | 5 |
| #3 | Hoentschel Jan | 4 |
| #4 | Horstmann Manfred | 3 |
| #5 | Baars Peter | 2 |
| #6 | Scheiper Thilo | 2 |
| #7 | Scott Casey | 2 |
| #8 | Boschke Roman | 2 |
| #9 | Schroeder Vivien | 1 |
| #10 | Werner Thomas | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2013137257A1 | Method of forming a semiconductor device by using sacrificial gate electrodes and sacrificial self-aligned contact structures |