WANG CHUAN-WEI has a total of 18 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2009. It filed its patents most often in United States and Taiwan. Its main competitors in its focus markets micro-structure and nano-technology, audio-visual technology and measurement are MEMSEN ELECTRONICS INC, INVENSENSE INC and SENSFAB PTE LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 17 | |
#2 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Micro-structure and nano-technology | |
#2 | Audio-visual technology | |
#3 | Measurement | |
#4 | Semiconductors | |
#5 | Basic communication technologies | |
#6 | Control | |
#7 | Machines |
# | Name | Total Patents |
---|---|---|
#1 | Wang Chuan-Wei | 18 |
#2 | Lee Sheng-Ta | 5 |
#3 | Hsu Hsin-Hui | 4 |
#4 | Tsai Ming-Han | 2 |
#5 | Sun Chih-Ming | 2 |
#6 | Wang Wei-Chung | 1 |
#7 | Lu Chih-Hung | 1 |
#8 | Chen Hsin-Chia | 1 |
Publication | Filing date | Title |
---|---|---|
US2017221328A1 | Abnormal status monitoring system | |
US2014217522A1 | Microphone structure | |
TW201322366A | Sensor manufacturing method | |
US2012075422A1 | 3D information generator for use in interactive interface and method for 3D information generation | |
US2010258885A1 | MEMS structure preventing stiction | |
US2011024852A1 | MEMS device and MEMS spring element | |
US2011162453A1 | Mass for use in a micro-electro-mechanical-system sensor and 3-dimensional micro-electro-mechanical-system sensor using same | |
US2011127620A1 | MEMS integrated chip and method for making same |