|
CN111337187A
|
|
Packaging structure of micro differential pressure module
|
|
WO2020125308A1
|
|
Bulk acoustic resonator and preparation method therefor
|
|
WO2020206981A1
|
|
Differential pressure sensor package structure and electronic device
|
|
WO2020206982A1
|
|
Bulk acoustic resonator and manufacturing method thereof
|
|
CN110808277A
|
|
Wafer structure and preparation method thereof
|
|
CN110620978A
|
|
Silicon microphone
|
|
CN110127597A
|
|
Dorsal pore lead type pressure sensor and preparation method thereof
|
|
CN110113687A
|
|
Silicon microphone
|
|
CN110049419A
|
|
Silicon microphone
|
|
CN109809355A
|
|
Pressure sensor and its manufacturing method
|
|
CN108645548A
|
|
Pressure sensor packaging structure and forming method thereof, touch device
|
|
CN107892268A
|
|
Pressure sensor and its manufacture method
|
|
CN107666645A
|
|
Differential capacitance type microphone with double diaphragm
|
|
US2018146300A1
|
|
Micro-silicon microphone and fabrication method thereof
|
|
CN107235468A
|
|
A kind of mems device and its manufacture method
|
|
KR20180078178A
|
|
Miniature silicon microphone and method of manufacturing the same
|
|
CN105120417A
|
|
Monolithic integrated chip and manufacturing method thereof
|
|
CN105236343A
|
|
Dielectric isolation type pressure sensor encapsulating structure
|
|
CN105181230A
|
|
Pressure sensor and packaging method thereof
|
|
CN104266781A
|
|
Piezoresistive pressure sensor and manufacturing method thereof
|
