| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 10 | |
| #2 | Japan | 8 | |
| #3 | Germany | 1 | |
| #4 | EPO (European Patent Office) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Machines | |
| #3 | Audio-visual technology | |
| #4 | Materials and metallurgy | |
| #5 | Surface technology and coating | |
| #6 | Electrical machinery and energy | |
| #7 | Measurement |
| # | Name | Total Patents |
|---|---|---|
| #1 | Fukaya Masashi | 7 |
| #2 | Fukuta Junzo | 6 |
| #3 | Araki Hideaki | 6 |
| #4 | Nishigaki Susumu | 3 |
| #5 | Miyase Yoshiyuki | 2 |
| #6 | Kuratani Shusei | 2 |
| #7 | Sakuramoto Hisashi | 2 |
| #8 | Nomura Tohru | 2 |
| #9 | Yano Shinsuke | 2 |
| #10 | Mizuno Shinya | 2 |
| Publication | Filing date | Title |
|---|---|---|
| US5543661A | Semiconductor ceramic package with terminal vias | |
| US5456778A | Method of fabricating ceramic circuit substrate | |
| US5470412A | Process for producing a circuit substrate | |
| US5156903A | Multilayer ceramic substrate and manufacture thereof | |
| JPH01157447A | High dielectric constant porcelain composition |