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VIASYSTEMS GROUP INC

Overview
  • Total Patents
    75
About

VIASYSTEMS GROUP INC has a total of 75 patent applications. Its first patent ever was published in 1999. It filed its patents most often in China, United States and EPO (European Patent Office). Its main competitors in its focus markets audio-visual technology, optics and machines are NEWPLEX TECHNOLOGY CO LTD, HONEYWELL ADVANCED CIRCUITS IN and CYMMETRIK ENTERPRISE CO LTD.

Patent filings per year

Chart showing VIASYSTEMS GROUP INCs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Tourne Joseph A A M 20
#2 Cotton Martin A 12
#3 Wyatt Brendan 8
#4 Kiernan Barry 7
#5 Kempen Hein Van 6
#6 Jones Steve 4
#7 Tourne A A M Joseph 4
#8 Tourne Joseph A 3
#9 Tourne Joan 3
#10 Kelly Andrew 3

Latest patents

Publication Filing date Title
CN103084440A Application of mirco-connection in metal plate arc bending
CN101692757A Process for manufacturing 12OZ thick copper multilayer circuit board
US2008127484A1 Selective filling of through holes
WO2007086961A2 Circuit board having a multi-signal via
US2006215965A1 Circuit board assembly having a guide insert
US2006098914A1 Fiber optic circuit connector
CN101547563A Closed loop backdrilling system
US2006278430A1 Method for manufacturing a midplane
WO2004060035A1 Circuit board having a multi-functional hole
AU2003241611A1 A cabinet and method for assembling the same
US6974036B2 Corner post and manufacturing process for making same
AU2003219304A1 Rack frame structure and method of assembling same
US6818115B2 System and method for electrolytic plating
WO03001265A1 Optical fiber right angle transition
EP1412785A2 Bending an optical fiber into a backplane
CN1870862A System and method for integrating optical layers in a PCB for inter-board communications
EP1500961A2 Fiberoptic circuit board and method of forming an optical connection thereof by embedding an optical interface
EP1334394A2 Fibre optic circuit board connector
US6581202B1 System and method for monitoring and improving dimensional stability and registration accuracy of multi-layer PCB manufacture
US6651324B1 Process for manufacture of printed circuit boards with thick copper power circuitry and thin copper signal circuitry on the same layer