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ULVAC MATERIAL KK

Overview
  • Total Patents
    18
About

ULVAC MATERIAL KK has a total of 18 patent applications. Its first patent ever was published in 2004. It filed its patents most often in Japan. Its main competitors in its focus markets surface technology and coating, materials and metallurgy and electrical machinery and energy are KOBELCO RES INST INC, SINTEC KERAMIK GMBH and KOBELCO KAKEN KK.

Patent filings in countries

World map showing ULVAC MATERIAL KKs patent filings in countries
# Country Total Patents
#1 Japan 18

Patent filings per year

Chart showing ULVAC MATERIAL KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Kin Yutaka 8
#2 Ito Manabu 5
#3 Rinoen Kaoru 4
#4 Oshiro Masaharu 3
#5 Masuda Tadashi 3
#6 Oba Akira 3
#7 Nitta Junichi 3
#8 Itasaka Ken 2
#9 Hashiguchi Shoichi 2
#10 Okubo Tadamune 2

Latest patents

Publication Filing date Title
JP2010270004A Method for manufacturing composite oxide-sintered compact and sputtering target composed of the same
JP2010106330A Method for manufacturing sputtering target, sputtering target, and sputtering apparatus
JP2009234601A Packaging device and packaging method
JP2009191323A Sputtering target manufacturing method, sputtering target cleaning method, sputtering target, and sputtering apparatus
JP2009191324A Backing plate manufacturing method, backing plate, sputter cathode, sputtering apparatus, bucking plate cleaning method
JP2009155171A Method for producing lead zirconium titanate-based sintered body, lead zirconium titanate-based sintered body, and lead zirconium titanate-based sputtering target
JP2009046340A Method for producing lithium phosphate sintered compact, and sputtering target
JP2009007626A Method for producing aluminum-lithium alloy target, and aluminum-lithium alloy target
JP2008279317A Deposit removing device/method
JP2007302996A Ta SPUTTERING TARGET AND METHOD FOR PRODUCING THE SAME
JP2008195554A Ito sintered compact, ito sputtering target and its manufacturing method
JP2008095132A Device component for vacuum film deposition device, etching device or the like, method for producing the same, and method for reproducing the same
JP2007297683A Magnet assembly, instrument for measuring magnetic leakage flux by using the magnet assembly, method for measuring magnetic leakage flux, and testing method
JP2007297679A Sputtering target of cobalt and manufacturing method therefor
JP2007297654A Sputtering target, joint type sputtering target and method for producing the same
JP2007055055A Mold, plate-shaped sintered body, method for producing the sintered body, sputtering target, and method for producing sputtering target
JP2005330158A Method for manufacturing complex oxide sintered body, and sputtering target composed of its sintered body
JP2005248296A Component for film deposition apparatus and film deposition apparatus