| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 5 | |
| #2 | United States | 3 | |
| #3 | Germany | 2 | |
| #4 | China | 1 | |
| #5 | Sweden | 1 | |
| #6 | WIPO (World Intellectual Property Organization) | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Audio-visual technology | |
| #3 | Semiconductors | |
| #4 | Electrical machinery and energy | |
| #5 | Packaging and shipping |
| # | Name | Total Patents |
|---|---|---|
| #1 | Gieskes Koenraad A | 3 |
| #2 | Gieskes Koenraad Alexander | 3 |
| #3 | Adams Sean M | 3 |
| #4 | Davis Peter | 3 |
| #5 | Tarrant Dean | 2 |
| #6 | Danek John E | 2 |
| #7 | Weiss Darrin Michael | 2 |
| #8 | Hibbard Daniel Joseph | 1 |
| #9 | Gieskes Koen Alexander | 1 |
| #10 | Janisiewicz Stanislaw Wladsyla | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2011182701A1 | Method and apparatus for transferring die from a wafer | |
| US2004188017A1 | Interface device with a releasable mount | |
| US2007220741A1 | Cabeless interconnect system for pick and place machine |