| # | Country | Total Patents | |
|---|---|---|---|
| #1 | EPO (European Patent Office) | 7 | |
| #2 | United States | 6 | |
| #3 | Republic of Korea | 4 | |
| #4 | Hong Kong | 2 | |
| #5 | Singapore | 2 | |
| #6 | China | 1 | |
| #7 | Malaysia | 1 | |
| #8 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Machines | |
| #2 | Semiconductors | |
| #3 | Audio-visual technology | |
| #4 | Machine tools |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Casings and printed circuits | |
| #3 | Unspecified technologies | |
| #4 | Grinding tools | |
| #5 | Working stone | |
| #6 | Presses | |
| #7 | Metal-working | |
| #8 | Unspecified technologies |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ishii Mitoshi | 17 |
| #2 | Mitoshi Ishii | 2 |
| #3 | Ishii Midori | 1 |
| #4 | Kenbin Donburi | 1 |
| #5 | Ishi Midoshi | 1 |
| #6 | Ishii Mithoshi | 1 |
| #7 | Ishil Mitoshi | 1 |
| Publication | Filing date | Title |
|---|---|---|
| CN1188985A | Lead bending machine for electronic components | |
| US5956838A | IC leadframe processing system | |
| KR100200508B1 | Method of bending lead of electric part and bender thereof |