ISHII KOSAKU KENKYUSHO KK has a total of 11 patent applications. Its first patent ever was published in 1994. It filed its patents most often in Japan and Taiwan. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are ISHII TOOL & ENGINEERING CORP, UI HOLDING CO and CREATIVE TECHNOLOGY KK.
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Audio-visual technology | |
#3 | Machines | |
#4 | Machine tools |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Casings and printed circuits | |
#3 | Unspecified technologies | |
#4 | Metal-working | |
#5 | Working stone | |
#6 | Grinding tools |
# | Name | Total Patents |
---|---|---|
#1 | Ishii Mitoshi | 7 |
#2 | Matsushita Hiroshi | 2 |
#3 | Honda Hironori | 1 |
#4 | Ishii Jinkai | 1 |
#5 | Sasaki Masanori | 1 |
#6 | Ishii Tadanori | 1 |
#7 | Abe Hiroshi | 1 |
#8 | Shiba Kenji | 1 |
#9 | Nasu Takeshi | 1 |
Publication | Filing date | Title |
---|---|---|
JP2020033033A | Pet bottle lid opening device | |
JP2019215034A | Handle operation device for opening/closing valve | |
JP2004186584A | Method and apparatus for cutting electronic component | |
JP2002100591A | Method and device for producing electronic component | |
JP2000164538A | Method and device for cutting ic | |
JPH10223818A | Ic lead frame working system | |
JPH10340986A | Method and apparatus for cutting unwanted part of ic lead frame | |
JPH10163396A | Lead bending apparatus for electronic component | |
JPH08288692A | Bending method for electric component lead and bending die | |
JPH0823001A | Method and apparatus for centering ic lead frame |