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TOKYO TUNGSTEN KK

Overview
  • Total Patents
    473
About

TOKYO TUNGSTEN KK has a total of 473 patent applications. Its first patent ever was published in 1974. It filed its patents most often in Japan, United States and EPO (European Patent Office). Its main competitors in its focus markets semiconductors, materials and metallurgy and textiles and paper are APPLIED NANOPARTICLE LAB CORP, NAPRA CO LTD and UNIV TOHOKU NAT UNIV CORP.

Patent filings in countries

World map showing TOKYO TUNGSTEN KKs patent filings in countries

Patent filings per year

Chart showing TOKYO TUNGSTEN KKs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Ichida Akira 75
#2 Seto Hiroyuki 47
#3 Arikawa Tadashi 35
#4 Asada Nobuaki 28
#5 Tsuchiya Mitsuru 26
#6 Doi Yoshihiko 24
#7 Takebe Katsutsugu 20
#8 Udagawa Teiichi 19
#9 Kimura Kuninari 17
#10 Takaoka Shigehiko 17

Latest patents

Publication Filing date Title
JP2000334692A Roundm tooth slitter and polishing jig therefor
JP2000317559A Wire straightening machine
JP2000323632A Heat radiating substrate and manufacture thereof
JP2000319774A Sputtering target material
JP2000268738A Magnetron endhat assembly
JP2000234167A Molybdenum sputtering target material and its production
JP2000223632A Heat radiation substrate and manufacture thereof
JPH11312484A Rotating anode for x-ray tube and its manufacture
JP2000216278A Semiconductor package and manufacture of heat radiating substrate using for the same
JP2000195889A Compound micro ball and its manufacture
JPH11317416A Composite microball, and manufacture of the same and device thereof
JP2000129389A Molybdenum sintered compact and its manufacture
JP2000088887A Membrane type probe device
JP2000087106A Die for forming cemented carbide powder and press- formation method of cemented carbide powder using this die
JP2000072429A Vanadium carbide powder and its production
JP2000064033A Sputtering target
JP2000063971A Sputtering target
JPH11124642A Iridium-containing metallic material and its production
JPH11307701A Heat sink and manufacture therefor
JP2000026926A Composite material for lead frame and semiconductor package using it