| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 17 |
| # | Industry | |
|---|---|---|
| #1 | Semiconductors | |
| #2 | Materials and metallurgy | |
| #3 | Electrical machinery and energy | |
| #4 | Micro-structure and nano-technology |
| # | Technology | |
|---|---|---|
| #1 | Semiconductor devices | |
| #2 | Working metallic powder | |
| #3 | Cables and insulators | |
| #4 | AC and DC conversion devices | |
| #5 | Non-metallic elements | |
| #6 | Nanostructure applications |
| # | Name | Total Patents |
|---|---|---|
| #1 | Ye Huaiyu | 14 |
| #2 | Zhang Guoqi | 12 |
| #3 | Liu Xu | 10 |
| #4 | Aori Geli | 6 |
| #5 | Zhang Weihong | 5 |
| #6 | Young David | 3 |
| #7 | Liu Yang | 3 |
| #8 | Jiang Zhenyu | 3 |
| #9 | Wen Zhengxin | 3 |
| #10 | Chen Shishi | 2 |
| Publication | Filing date | Title |
|---|---|---|
| WO2021068399A1 | Stacked crimp-type power module and method for manufacture thereof | |
| WO2021047078A1 | Crimp-type power switch module and manufacturing method therefor |