| # | Country | Total Patents | |
|---|---|---|---|
| #1 | WIPO (World Intellectual Property Organization) | 23 | |
| #2 | Australia | 7 | |
| #3 | Japan | 7 | |
| #4 | China | 3 | |
| #5 | EPO (European Patent Office) | 3 | |
| #6 | United Kingdom | 1 | |
| #7 | United States | 1 |
| # | Industry | |
|---|---|---|
| #1 | Surface technology and coating | |
| #2 | Electrical machinery and energy | |
| #3 | Semiconductors | |
| #4 | Machines | |
| #5 | Mechanical elements |
| # | Name | Total Patents |
|---|---|---|
| #1 | Licata Thomas J | 9 |
| #2 | Hillman Joseph T | 8 |
| #3 | Lantsman Alexander D | 7 |
| #4 | Ameen Michael S | 6 |
| #5 | Seirmarco James Anthony | 4 |
| #6 | Ashtiani Kaihan Abidi | 4 |
| #7 | Arena Chantal | 3 |
| #8 | Yasar Tugrul | 3 |
| #9 | Betram Ronald T | 3 |
| #10 | Macquignon Claude | 3 |
| Publication | Filing date | Title |
|---|---|---|
| WO0109929A2 | Method for etch rate enhancement by background oxygen control in a soft etch system | |
| JP2001089860A | Device and method for dry-cleaning of treating chamber | |
| WO0003055A1 | Shield for ionized physical vapor deposition apparatus | |
| WO0038214A1 | Cathode having variable magnet configuration | |
| AU6977998A | Method and apparatus for ionized sputtering of materials | |
| US6190512B1 | Soft plasma ignition in plasma processing chambers |