TEVET PROCESS CONTROL TECHNOLO has a total of 23 patent applications. Its first patent ever was published in 1998. It filed its patents most often in Australia, EPO (European Patent Office) and United States. Its main competitors in its focus markets measurement, optics and semiconductors are METRIS N V, SA08700334 and MARPOSS SOCIETA' PER AZIONI.
# | Country | Total Patents | |
---|---|---|---|
#1 | Australia | 4 | |
#2 | EPO (European Patent Office) | 4 | |
#3 | United States | 4 | |
#4 | WIPO (World Intellectual Property Organization) | 4 | |
#5 | China | 3 | |
#6 | Canada | 1 | |
#7 | Israel | 1 | |
#8 | Republic of Korea | 1 | |
#9 | Norway | 1 |
# | Industry | |
---|---|---|
#1 | Measurement | |
#2 | Optics | |
#3 | Semiconductors | |
#4 | Control | |
#5 | Environmental technology |
# | Name | Total Patents |
---|---|---|
#1 | Du-Nour Ofer | 19 |
#2 | Rubinstein Vladimir | 5 |
#3 | Ish-Shalom Yaron | 4 |
#4 | Du Nour Ofer | 1 |
#5 | Yaron Ish-Shalom | 1 |
#6 | Vladimir Du-Nour Ofer Rubinste | 1 |
#7 | Ofer Du-Nour | 1 |
Publication | Filing date | Title |
---|---|---|
US2004080761A1 | Method and apparatus for thickness decomposition of complicated layer structures | |
US2003098704A1 | Method and apparatus for measuring stress in semiconductor wafers | |
US2003002032A1 | Method and apparatus for production line screening | |
IL125964D0 | Method and apparatus for measuring the thickness of a transparent film, particularly of a photoresist film on a semiconductor substrate |