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TETOS CO LTD

Overview
  • Total Patents
    53
  • GoodIP Patent Rank
    28,141
  • Filing trend
    ⇧ 100.0%
About

TETOS CO LTD has a total of 53 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2014. It filed its patents most often in Republic of Korea, China and United States. Its main competitors in its focus markets audio-visual technology, surface technology and coating and semiconductors are KOJIMA CHEMICALS CO LTD, ADVANTECH GLOBAL LTD and KOJIMA KAGAKU YAKUHIN KK.

Patent filings per year

Chart showing TETOS CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Song Kun Ho 32
#2 Park Seong Wan 13
#3 Ahn Woo Young 12
#4 Park Yeong Ung 4
#5 Lee Seung Jin 3
#6 Cho Bong Hyun 3
#7 Song Kun-Ho 2
#8 Park Sun Ho 2
#9 Song Geun Ho 1
#10 Park Seong-Wan 1

Latest patents

Publication Filing date Title
KR102188373B1 Apparatus for depositing both sides of a substrate
KR102188372B1 Apparatus for depositing both sides of a substrate
KR102225986B1 Apparatus for depositing both side portions of the substrate
KR20200137112A Method of forming wiring on side surface of substrate
KR20200137113A An exposure apparatus for forming a substrate circuit pattern
KR102179672B1 Method of forming wiring on side surface of substrate
KR20200125220A Automated substrate side deposition method
KR20200125219A Automated substrate side deposition apparatus
KR20200125124A Substrate Side Deposition Apparatus Improved Deposition Adhesive Force
KR20200113319A A substrate side deposition apparatus having a shield with improved cooling efficiency
KR20200112436A A substrate side deposition apparatus having a substrate mounting drum with improved cooling efficiency
KR20200111924A LED display module
KR102136701B1 Auxiliary rollers for roll―to―roll processes
KR20200100288A Roll­to­roll sputtering apparatus
KR20200037489A A device for depositing a metal film on a surface of a three-dimensional object
KR20200015166A Substrate side deposition apparatus
KR20200006668A Method of forming wiring on side surface of substrate
KR20200004950A wafer plating system
KR101984819B1 Method for manufacturing metal ball
KR101872305B1 Device and method for manufacturing metal ball