KOJIMA CHEMICALS CO LTD has a total of 70 patent applications. It increased the IP activity by 150.0%. Its first patent ever was published in 1990. It filed its patents most often in WIPO (World Intellectual Property Organization), Taiwan and China. Its main competitors in its focus markets surface technology and coating, audio-visual technology and semiconductors are TETOS CO LTD, KOJIMA KAGAKU YAKUHIN KK and CONDUCTIVE INKJET TECH LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | WIPO (World Intellectual Property Organization) | 13 | |
#2 | Taiwan | 12 | |
#3 | China | 9 | |
#4 | Republic of Korea | 9 | |
#5 | United States | 8 | |
#6 | EPO (European Patent Office) | 7 | |
#7 | Singapore | 5 | |
#8 | Philippines | 2 | |
#9 | Australia | 1 | |
#10 | Germany | 1 | |
#11 | United Kingdom | 1 | |
#12 | Hong Kong | 1 | |
#13 | Malaysia | 1 |
# | Name | Total Patents |
---|---|---|
#1 | Watanabe Hideto | 49 |
#2 | Kato Tomohito | 32 |
#3 | Kojima Kazuhiro | 13 |
#4 | Yagi Kaoru | 5 |
#5 | Arai Yotaro | 4 |
#6 | Honda Satoru | 4 |
#7 | Suzuki Masami | 4 |
#8 | Akimoto Takeumi | 4 |
#9 | Kawasumi Shinroku | 4 |
#10 | Kawasumi Shinichiro | 3 |
Publication | Filing date | Title |
---|---|---|
US2016230287A1 | Reductive electroless gold plating solution, and electroless gold plating method using the plating solution | |
TW201317389A | Eletoroless palladium plating solution | |
SG172087A1 | Electrolytic recovery device for gold or silver | |
US2010199882A1 | Electroless pure palladium plating solution | |
KR20060123417A | Process for producing metal micropowder having particle diameter uniformalized | |
WO2004099128A1 | Method for synthesizing metal complex | |
EP1480233A1 | Resistor | |
AU2001274534B2 | Palladium plating solution | |
EP1396559A1 | Palladium plating solution | |
DE4021681A1 | Non-electrolytic gold plattler solution |