TANIGUROGUMI CORP has a total of 26 patent applications. Its first patent ever was published in 2008. It filed its patents most often in EPO (European Patent Office), WIPO (World Intellectual Property Organization) and China. Its main competitors in its focus markets machine tools, audio-visual technology and semiconductors are TAMURA HIROAKI, CELESTICA INT INC and ZHANG LEILEI.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 7 | |
#2 | WIPO (World Intellectual Property Organization) | 6 | |
#3 | China | 4 | |
#4 | Republic of Korea | 4 | |
#5 | Taiwan | 4 | |
#6 | United States | 1 |
# | Industry | |
---|---|---|
#1 | Machine tools | |
#2 | Audio-visual technology | |
#3 | Semiconductors | |
#4 | Environmental technology | |
#5 | Machines | |
#6 | Materials and metallurgy | |
#7 | Basic materials chemistry |
# | Name | Total Patents |
---|---|---|
#1 | Taniguro Katsumori | 23 |
#2 | Watanabe Genzo | 9 |
#3 | Yokoyama Masanori | 2 |
#4 | Ishikawa Hisao | 2 |
#5 | Iwabuchi Kazunori | 1 |
Publication | Filing date | Title |
---|---|---|
US2016044795A1 | Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method | |
WO2013157075A1 | Solder bump and forming method therefor, and substrate having solder bump and manufacturing method for substrate having solder bump | |
KR20140135592A | Soldering device, soldering method, and substrate and electronic component produced by the soldering device or the soldering method | |
WO2013153674A1 | Soldering device and method, and manufactured substrate and electronic component | |
EP2260968A1 | Process for producing tin or solder alloy for electronic part | |
EP2302083A1 | Method of tinning or soldering electronic component with copper land portions |