Learn more

TAIWAN UYEMURA CO LTD

Overview
  • Total Patents
    29
  • GoodIP Patent Rank
    195,472
About

TAIWAN UYEMURA CO LTD has a total of 29 patent applications. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, China and Republic of Korea. Its main competitors in its focus markets semiconductors, surface technology and coating and chemical engineering are NEXCHIP SEMICONDUCTOR CORP, LINDERT NICK and CHONGQING SEMI CHIP ELECTRONIC CO LTD.

Patent filings in countries

World map showing TAIWAN UYEMURA CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 20
#2 China 4
#3 Republic of Korea 3
#4 Japan 2

Patent filings per year

Chart showing TAIWAN UYEMURA CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Zheng Jing-Hong 6
#2 Qiu Guo-Bin 6
#3 Liu Kun-Zheng 4
#4 Li Ying-Jie 4
#5 Huang Yao-De 3
#6 Wu Chang-Long 3
#7 Shen Zhi-Xiang 2
#8 Wang Kai Yi 2
#9 Guo Cai-Tong 2
#10 Lee Ying Chien 2

Latest patents

Publication Filing date Title
CN111663122A Method for metallizing liquid crystal polymer
TW202030364A Metallization method of liquid-crystal polymer (LCP) requiring no additional physical treatment to treat the LCP surface
TW201702579A Method and apparatus for automatically analyzing nickel concentration of electroless nickel baths may not be interfered with acid, alkali, and a complexing agent easily persons
TW201636454A Method for preparing chemical palladium- silver coating films and its structure
TW201529885A Polyimide substrate metallization method
TW201509579A Metallization method for plastic mold interconnect element
JP2014011463A Microbubble type processing apparatus
TW201445012A Metalized treatment method of aluminum substrate
TW201401348A Micro bubble processing device
TW201346076A Copper electroplating solution composition and electroplating method thereof
TW201341597A Low cyanide silver-electroplating electrolyte and electroplating method thereof
TW201341598A Silver-electroplating electrolyte and electroplating method thereof
TW201335421A Method of forming conductive layer on surface of nonconductor
TW201309843A Thin nickel-palladium-gold coating, package structure formed using the coating wire containing wire and method of producing the same
CN102605359A Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
TW201233279A Copper or palladium-copper wire package process and structure thereof
TW201233280A Chemical palladium-gold plating film method
TW201136469A Built-in circuit making method
TW201134599A Bond pad protection layer structure and manufacturing method thereof
TW200845847A Metal-removing catalyzer liquid and method for using the same