NEXCHIP SEMICONDUCTOR CORP has a total of 19 patent applications. Its first patent ever was published in 2018. It filed its patents most often in United States, China and Japan. Its main competitors in its focus markets semiconductors, surface technology and coating and chemical engineering are JIANGXI ZHAOCHI SEMICONDUCTOR CO LTD, HC OPTOELECTRONIC (ZHEJIANG) CO LTD and XIANGNENG HUALEI OPTOELECTRONIC CO LTD.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 7 | |
#2 | China | 6 | |
#3 | Japan | 5 | |
#4 | Taiwan | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Surface technology and coating | |
#3 | Chemical engineering | |
#4 | Control |
# | Technology | |
---|---|---|
#1 | Semiconductor devices | |
#2 | Coating metallic material | |
#3 | Cleaning | |
#4 | Systems for regulating electrical variables |
# | Name | Total Patents |
---|---|---|
#1 | Chern Geeng-Chuan | 3 |
#2 | Kumagai Yasuhiro | 3 |
#3 | Nakano Norio | 2 |
#4 | Kojima Hidemitsu | 2 |
#5 | Zhang Guowei | 2 |
#6 | Huang Chih-Hsien | 2 |
#7 | Zhang Yugui | 2 |
#8 | Fang Jian-Zhi | 2 |
#9 | Pu Tiansong | 2 |
#10 | Taya Masatoshi | 2 |
Publication | Filing date | Title |
---|---|---|
CN112201620A | Forming method of metal interconnection structure | |
CN112201619A | Forming method of metal interconnection structure | |
CN112226733A | Semiconductor equipment maintenance system and method | |
JP2020205134A | Sram, semiconductor integrated circuit, and lcd driver | |
JP2020191513A | Latch circuit | |
JP2020181884A | Capacitive semiconductor device | |
JP2020177949A | High breakdown voltage semiconductor element and manufacturing method thereof | |
JP2020113599A | Semiconductor element manufacturing method | |
CN110867384A | Semiconductor structure manufacturing method | |
CN110858561A | Silicon island structure and manufacturing method thereof |