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TAIWAN UNION TECHNOLOGY CORP

Overview
  • Total Patents
    149
  • GoodIP Patent Rank
    18,433
  • Filing trend
    ⇧ 21.0%
About

TAIWAN UNION TECHNOLOGY CORP has a total of 149 patent applications. It increased the IP activity by 21.0%. Its first patent ever was published in 2003. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets macromolecular chemistry and polymers, machines and surface technology and coating are TAIWAN UNION TECH CORP, SHENGYI TECHNOLOGY CO LTD and ZHONGSHAN ELITE MATERIAL CO LTD.

Patent filings in countries

World map showing TAIWAN UNION TECHNOLOGY CORPs patent filings in countries
# Country Total Patents
#1 Taiwan 60
#2 China 54
#3 United States 35

Patent filings per year

Chart showing TAIWAN UNION TECHNOLOGY CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Liu Shur-Fen 45
#2 Liao Chih-Wei 25
#3 Chen Hsien Te 22
#4 Hung Chin-Hsien 21
#5 Chen Meng-Huei 20
#6 Liao Chih Wei 17
#7 Huang Ju-Ming 17
#8 Tseng Guan-Syun 13
#9 Lin Tsung-Hsien 10
#10 Chen Hsien-Te 9

Latest patents

Publication Filing date Title
US2021060900A1 Metal-clad laminate, printed circuit board, and method for manufacturing the same
TWI686293B Metal-clad laminate and manufacturing method of the same
TW202045606A Resin composition and uses of the same
CN110551257A Resin composition, prepreg thereof, metal foil laminate and printed wiring board
TW202003689A Resin composition, pre-preg, metal-clad laminate, and printed circuit board using the same
TW202033658A Resin composition and uses of the same
TW202026345A Flexible prepreg and uses thereof
TW202022042A Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
TW202022029A High thermal conductivity prepreg and uses of the same
TW202016216A Thermal-curable resin composition, and pre-preg, metal-clad laminate and printed circuit board manufactured using the same
TW202014466A Solvent-free resin composition and uses of the same
TW202009264A Halogen-free low dielectric resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same
TW202009949A Dielectric composite and uses thereof
TW202000768A Resin composition, and pre-preg, metal-clad laminate, and printed circuit board using the same
TWI647265B Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
TWI654243B Resin composition, and prepreg, metal-clad laminate, and printed circuit board prepared using the same
TW201930448A Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same
TWI655263B Adhesive composition and uses of the same
TWI656172B Solvent-free resin composition and uses of the same
TW201912712A Resin composition, and pre-preg, metal-clad laminate and printed circuit board prepared using the same