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GUANGDONG SHENGYI SCI TECH CO

Overview
  • Total Patents
    155
  • GoodIP Patent Rank
    197,567
About

GUANGDONG SHENGYI SCI TECH CO has a total of 155 patent applications. Its first patent ever was published in 2002. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Republic of Korea. Its main competitors in its focus markets macromolecular chemistry and polymers, machines and audio-visual technology are TAIWAN UNION TECH CORP, ZHONGSHAN ELITE MATERIAL CO LTD and ISOLA USA CORP.

Patent filings per year

Chart showing GUANGDONG SHENGYI SCI TECH COs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Jinghong Ru 21
#2 He Yueshan 20
#3 Hongkui Wu 16
#4 Su Shiguo 15
#5 Zeng Xianping 12
#6 Minshe Su 11
#7 Shengpeng Liu 11
#8 Su Minshe 10
#9 Zhongqiang Yang 10
#10 Dongliang Liu 8

Latest patents

Publication Filing date Title
CN103102711A Method for improving hole-copper separation of PN curing plate
CN103102627A PTFE (polytetrafluoroethylene) base material with high filler content and preparation and application thereof
CN103102484A Crosslinkable polyphenyl ether resin, preparation method and use thereof
WO2014059654A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same
WO2014059653A1 Cyanate ester resin composition, and prepreg, laminate, and metal-clad laminate that are fabricated by using the same
WO2014036713A1 Thermosetting resin composition and copper-clad laminate fabricated with same
WO2014036712A1 Composite material, high frequency circuit substrate made from the same, and production method thereof
WO2014036711A1 Epoxy resin composition, and prepreg and laminated sheet coated with copper foil made from same
WO2013149386A1 Epoxy resin composition, and prepreg and laminated board coated with copper foil made from same
WO2013097127A1 Circuit substrate and manufacturing method thereof
KR20140073487A Method for preparing phosphorus-containing polyphenylene oxide resin with low molecular weight
WO2013097133A1 Thermoset resin composition, and prepreg and laminate for printed circuit board manufactured therefrom
CN102555348A Protective film used for producing non-adhesive double-sided flexible copper clad laminate and manufacturing method thereof
CN102558861A Halogen-free phosphate-free high-heat-resistance thermosetting resin composition as well as bonding sheet and copper clad laminate prepared from same
WO2013056411A1 Epoxy resin composition and prepreg and copper clad laminate manufactured by using the same
WO2013056419A1 Epoxy resin composition and high frequency electronic-circuit substrate manufactured by using the same
KR20140067005A Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
WO2013056428A1 Benzoxazine intermediate and preparation method thereof
WO2012151738A1 Embedded capacitance material and forming method thereof
CN102212250A Filler compound and copper clad laminate made of same