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Polymer matrix composite, prepreg and printed circuit board for eliminating skew and fiber weave effect
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Polymer matrix composite as well as prepreg and printed circuit board using same.
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Multilayer structure and substrate
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Multi-layered structure and substrate
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Polymer matrix composite for eliminating skew and fiber weave effect
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Laminated substrate and printed circuit board thereof
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Halogen-free epoxy resin composition, laminated substrate and printed circuit board thereof
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Halogen-free epoxy resin component with low-dielectric loss
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Non-halogen epoxy resin composition having low dielectric loss
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Heat-radiating substrate with inorganic filler
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Heat dissipation substrate having inorganic filler
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Halogen-free resin composition
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Non-halogen resin composition
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Low dielectric material
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Dielectric materials
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Low dielectric materials
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Glue infiltration device
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Electromagnetic wave interference shielding film
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Electromagnetic interference shielding film
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