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TAIWAN MICROLOOPS CORP

Overview
  • Total Patents
    53
  • GoodIP Patent Rank
    33,398
  • Filing trend
    ⇧ 60.0%
About

TAIWAN MICROLOOPS CORP has a total of 53 patent applications. It increased the IP activity by 60.0%. Its first patent ever was published in 2004. It filed its patents most often in United States, Taiwan and Germany. Its main competitors in its focus markets thermal processes, semiconductors and audio-visual technology are ICURIE LAB INC, KELVIN THERMAL TECH INC and CHAUN-CHOUNG TECH CORP.

Patent filings in countries

World map showing TAIWAN MICROLOOPS CORPs patent filings in countries
# Country Total Patents
#1 United States 27
#2 Taiwan 21
#3 Germany 1
#4 France 1
#5 United Kingdom 1
#6 Japan 1
#7 Republic of Korea 1

Patent filings per year

Chart showing TAIWAN MICROLOOPS CORPs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Lin Chun-Hung 37
#2 Lin Chun Hung 7
#3 Su Cherng-Yuh 6
#4 Huang Yen-Chia 6
#5 Chiu Chien-Wen 6
#6 Lee Kuo-Ying 6
#7 Lin Chien-Hung 5
#8 Wang Chih-Wei 2
#9 Lin Chien Hung 2
#10 Lee Kuo Ying 2

Latest patents

Publication Filing date Title
TWI710742B Vapor chamber
TWI708038B Heat dissipating device using phase changes to transmit heat
US2020355441A1 Integrated vapor chamber and manufacturing method thereof
US2020333083A1 Heat dissipating module with two vapor chambers
TWI682144B Integrated vapor chamber and method thereof
TWI691256B Duel vapor chamber heat dissipation module
TWI691255B Flow uniformized liquid heat dissipation system for cabinet and serial system thereof
TWI688331B Flow uniformized pressured liquid heat dissipation system
US2020232714A1 Heat dissipating device
TWI682143B Heat sink
US2020032814A1 Water pump having direction adjusting mechanism
US2020032807A1 Cooling fan module
US2020033067A1 Heat sink and cooling device using the same
TW202004028A Water pump with direction adjustment mechanism
TW201947181A Heat sink and heat dissipation device using same
US2019234691A1 Thermal module
TW201931539A Thermal module
US2019003775A1 Anti-bending heat dissipation module
US2018350718A1 Thermal conduction structrure and manufacturing method thereof
US10048015B1 Liquid-vapor separating type heat conductive structure