KELVIN THERMAL TECH INC has a total of 24 patent applications. It decreased the IP activity by 16.0%. Its first patent ever was published in 2015. It filed its patents most often in United States, China and WIPO (World Intellectual Property Organization). Its main competitors in its focus markets thermal processes, semiconductors and machine tools are TAIWAN MICROLOOPS CORP, AKACHI HISATERU and ICURIE LAB INC.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 13 | |
#2 | China | 4 | |
#3 | WIPO (World Intellectual Property Organization) | 4 | |
#4 | EPO (European Patent Office) | 3 |
# | Industry | |
---|---|---|
#1 | Thermal processes | |
#2 | Semiconductors | |
#3 | Machine tools | |
#4 | Audio-visual technology | |
#5 | Machines | |
#6 | Computer technology | |
#7 | Micro-structure and nano-technology | |
#8 | Surface technology and coating | |
#9 | Transport |
# | Name | Total Patents |
---|---|---|
#1 | Lee Yung-Cheng | 19 |
#2 | Yang Ronggui | 16 |
#3 | Lewis Ryan John | 12 |
#4 | Liew Li-Anne | 6 |
#5 | Oshman Christopher | 5 |
#6 | Peterson George P | 5 |
#7 | Bright Victor M | 5 |
#8 | Li Chen | 5 |
#9 | Shi Bo | 5 |
#10 | Wang Yunda | 4 |
Publication | Filing date | Title |
---|---|---|
CN111873750A | Heat energy supply and management system of logistics transport vehicle | |
US2020300563A1 | Micropillar-enabled thermal ground plane | |
WO2020123631A1 | Vapor chamber | |
US2019390919A1 | Polymer-based microfabricated thermal ground plane | |
US2018320984A1 | Thermal management planes | |
CN110006282A | Hot ground plane | |
US2018128553A1 | Method and device for spreading high heat fluxes in thermal ground planes | |
US2018106554A1 | Method and device for optimization of vapor transport in a thermal ground plane using void space in mobile systems | |
US2016161193A1 | Polymer-based microfabricated thermal ground plane | |
WO2016114840A2 | Polymer-based microfabricated thermal ground plane | |
US2015226493A1 | Flexible thermal ground plane and manufacturing the same |