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HSU HUL-CHUN

Overview
  • Total Patents
    29
About

HSU HUL-CHUN has a total of 29 patent applications. Its first patent ever was published in 2004. It filed its patents most often in United States. Its main competitors in its focus markets thermal processes, machines and semiconductors are YANG HSIU-WEI, AKACHI HISATERU and AISA VITAL COMPONENTS CHINA CO LTD.

Patent filings in countries

World map showing HSU HUL-CHUNs patent filings in countries
# Country Total Patents
#1 United States 29

Patent filings per year

Chart showing HSU HUL-CHUNs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hsu Hul-Chun 29

Latest patents

Publication Filing date Title
US2009072534A1 Sealed structure of circular tubular heat pipe
US2008105405A1 Heat Pipe Multilayer Capillary Wick Support Structure
US2006283578A1 Method for removing vapor within heat pipe
US2008035313A1 Heat-Conducting Base and Isothermal Plate having the same
US2008035310A1 Isothermal Plate Module
US2006243426A1 Wick Structure of Heat Pipe
US2006086483A1 Heat pipe structure and method for fabricating the same
US2006202474A1 Extrusion-sealed structure of heat pipe
US2006202000A1 Eccentric rotation soldering method and apparatus
US2006165150A1 Method and apparatus for examining heat pipe temperature using infrared thermography
US2006162905A1 Heat pipe assembly
US2006162160A1 Gas removal method and apparatus for heat pipe
US2006162161A1 Method and apparatus for continuous parallel conveyance of heat pipe
US2006162152A1 Processing apparatus for continuously conveying heat pipes
US2006163036A1 Processing apparatus with conveying unit for continuously conveying heat pipes
US2006048919A1 Wick structure of heat pipe
US2006005960A1 End surface capillary structure of heat pipe
US2005269064A1 Planar heat pipe structure
US2005274494A1 Method for forming end surface of heat pipe and structure thereof
US2005252650A1 Integrated heat dissipation apparatus