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TAIWAN ELECTRONIC PACKAGING CO LTD

Overview
  • Total Patents
    15
  • GoodIP Patent Rank
    187,551
About

TAIWAN ELECTRONIC PACKAGING CO LTD has a total of 15 patent applications. Its first patent ever was published in 2002. It filed its patents most often in Taiwan, China and United States. Its main competitors in its focus markets semiconductors and environmental technology are AKHAN TECHNOLOGIES INC, PIONEER OLED LIGHTING DEVICES CORP and SHEN YUNONG.

Patent filings in countries

World map showing TAIWAN ELECTRONIC PACKAGING CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 10
#2 China 3
#3 United States 2

Patent filings per year

Chart showing TAIWAN ELECTRONIC PACKAGING CO LTDs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Wu Cherng-Chiao 5
#2 Wu Cheng-Jiao 3
#3 Wu Chengjiao 2
#4 Chengjiao Wu 1

Latest patents

Publication Filing date Title
CN112053995A Optical sensing chip package structure
TWI710074B Packaging structure of optical sensing chip
US2020312827A1 Optical sensing chip packaging structure
CN111508941A Optical sensing chip packaging structure
TW202029421A Packaging structure of optical sensing chip having a transparent cover plate covering a light-sensing element and a light-emitting element
TW201025525A Chip module structure assembly
TW201007962A Structural assembly of solar panel
CN101539038A Thermal circulation system
TW200934282A Sensor chip package structure with autofocus
TW200933901A Sensor chip package structure
TW200407561A Manufacturing method of lens module and product thereof