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SAMCO INTERNAT INC

Overview
  • Total Patents
    16
About

SAMCO INTERNAT INC has a total of 16 patent applications. Its first patent ever was published in 2000. It filed its patents most often in Japan and Taiwan. Its main competitors in its focus markets semiconductors and environmental technology are HAT TEKNOLOJI A S, CHANGZHOU STAR SEA ELECTRONICS CO LTD and SHEN YUNONG.

Patent filings in countries

World map showing SAMCO INTERNAT INCs patent filings in countries
# Country Total Patents
#1 Japan 15
#2 Taiwan 1

Patent filings per year

Chart showing SAMCO INTERNAT INCs patent filings per year from 1900 to 2020

Focus industries

Top inventors

# Name Total Patents
#1 Tsuji Osamu 6
#2 Tatsuta Toshiaki 5
#3 Honjo Ichihiro 5
#4 Hiramoto Michihiro 4
#5 Motoyama Shinichi 4
#6 Terai Hirokazu 3
#7 Nishihara Yasuhiro 3
#8 Yamazoe Hiroshi 3
#9 Nakano Hirohiko 3
#10 Nakagami Shinji 2

Latest patents

Publication Filing date Title
JP2005078798A Plasma generation method and plasma generation device
JP2004356595A Method of manufacturing silicon-based film containing carbon using cathode coupling-type plasma cvd equipment
JP2004273839A Apparatus for producing multilayered thin film
JP2004267893A Atomizer for forming ceramic thin film and thin film manufacturing method using the atomizer
TW200303051A Dry etching method of gallium nitride based compound semiconductor
JP2003303809A Dry etching method for gallium-nitride compound semiconductor and the like
JP2004128366A Plasma processing apparatus
JP2004119938A Manufacturing method for a silicon oxide film and apparatus thereof
JP2003305565A Method for manufacturing copper electrode for solder connecting and copper electrode
JP2003221670A Plasma treatment apparatus
JP2002151481A Plasma processing apparatus and plasma processing method
JP2002329720A Protective film for device and its manufacturing method
JP2002234521A Method for forming film on wall surface of plastic container, film forming device, and plastic container
JP2002222827A Electrode, its surface treatment method, and wire bonding method
JP2002050852A Method and device for plasma cleaning
JP2001254188A Inductively coupled plasma treatment apparatus