| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 10 | |
| #2 | Republic of Korea | 3 | |
| #3 | Taiwan | 1 |
| # | Name | Total Patents |
|---|---|---|
| #1 | Huang Yen Po | 3 |
| #2 | Huang Yen-Po | 3 |
| #3 | Lin Chih-Wei | 3 |
| #4 | Tsai Tsung-Hsien | 2 |
| #5 | Lai Chun-Ting | 2 |
| #6 | Wu Jia-Hao | 2 |
| #7 | Wu Paul S C | 2 |
| #8 | Lai Yu-Chen | 2 |
| #9 | Tsai Tsung Hsien | 2 |
| #10 | Yang Wu-Yung | 1 |
| Publication | Filing date | Title |
|---|---|---|
| KR20180016230A | Flexible substrate assembly and its application for fabricating flexible printed circuits | |
| TW201627162A | Low-glass doubl polyimide film and method for manufacturing the same |