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ELITE ELECTRONIC MATERIAL KUNSHAN CO LTD

Overview
  • Total Patents
    22
  • GoodIP Patent Rank
    172,183
  • Filing trend
    ⇧ 100.0%
About

ELITE ELECTRONIC MATERIAL KUNSHAN CO LTD has a total of 22 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2012. It filed its patents most often in Taiwan, United States and China. Its main competitors in its focus markets macromolecular chemistry and polymers, machines and audio-visual technology are ELITE MATERIAL CO LTD, GUANGDONG SHENGYI TECH CO LTD and ELITE ELECTRONIC MATERIAL ZHONGSHAN CO LTD.

Patent filings in countries

World map showing ELITE ELECTRONIC MATERIAL KUNSHAN CO LTDs patent filings in countries

Patent filings per year

Chart showing ELITE ELECTRONIC MATERIAL KUNSHAN CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Rong-Tao 18
#2 Tian Wenjun 8
#3 Ma Ziqian 8
#4 Ma Zi-Qian 4
#5 Wang Rongtao 4
#6 Jia Ning-Ning 4
#7 Lu Wenfeng 4
#8 Yuan Ming-Sheng 3
#9 Gao Yu 3
#10 Xie Zhen-Yu 3

Latest patents

Publication Filing date Title
TW202102605A Resin composition and article made therefrom
TW202012462A Prepolymerized resin and use thereof
TW202000683A Phosphorus-containing compound, phosphorus-containing flame retardant, preparation method thereof, and article made therefrom
TW201905089A Resin composition and product thereof
TW201811913A Resin composition, article of manufacture made therefrom and method of making the same
TW201615673A Low dissipation factor resin composition and product made thereby
TW201620977A Aromatic tetrafunctional vinylbenzyl resin composition and use thereof
TW201623372A Polyphenylene oxide resin, method of preparing polyphenylene oxide resin, polyphenylene oxide prepolymer and resin composition
TW201506081A A low dielectric resin composition and a copper foil substrate and a printed circuit board to which the copper foil substrate is used
CN104583309A Resin composition, and copper coil substrate and printed circuit board thereof
TW201441297A Halogen-free resin composition and copper foil substrate and printed circuit board to which the same applies
US2014174802A1 Lowdielectric resin composition, copper clad laminate using the same, and printed circuit board using the same
TW201416395A Halogen-free resin composition and its application
TW201404822A Halogen-free resin composition and the use of its copper foil substrate and printed circuit board
TW201319136A An inorganic filler, a resin composition and a use thereof
TW201319137A Inorganic filler and electric material containing the same