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MICROCOSM TECHNOLOGY CO LTD

Overview
  • Total Patents
    73
  • GoodIP Patent Rank
    33,392
  • Filing trend
    ⇩ 55.0%
About

MICROCOSM TECHNOLOGY CO LTD has a total of 73 patent applications. It decreased the IP activity by 55.0%. Its first patent ever was published in 2001. It filed its patents most often in Taiwan, Japan and Republic of Korea. Its main competitors in its focus markets audio-visual technology, macromolecular chemistry and polymers and surface technology and coating are QINGDING PREC ELECTRONICS HUAIAN CO LTD, AEG ISOLIER KUNSTSTOFF and KLINGEL WOLFGANG.

Patent filings in countries

World map showing MICROCOSM TECHNOLOGY CO LTDs patent filings in countries
# Country Total Patents
#1 Taiwan 47
#2 Japan 8
#3 Republic of Korea 8
#4 China 6
#5 United States 4

Patent filings per year

Chart showing MICROCOSM TECHNOLOGY CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Huang Tang-Chieh 26
#2 Huang Tang-Jie 21
#3 Huang Tang Chieh 10
#4 Chuang Chau-Chin 7
#5 Juang Jau-Chin 7
#6 Chuang Chau Chin 6
#7 Zhuang Chao-Qin 6
#8 Lai Bo-Hung 5
#9 Hoan Tan Jie 3
#10 Hsieh Kun-Han 3

Latest patents

Publication Filing date Title
TW202037685A Flexible display cover substrate
TW202037650A Polyimide film and flexible display device cover substrate using the same
TWI685717B Photosensitive resin composition and application thereof
TW202026361A Photosensitive polyimide resin composition and polyimide film thereof
TWI685716B Photosensitive polyimide resin composition and polyimide film thereof
TWI673902B Flexible sealing structure
TWI679112B Flexible sealing film, flexible sealing member and flexible sealing structure
TWI661022B Adhesive composition and adhesive sheet and cured product thereof
TWI656629B Coyer plate for flexible display device and flexible display device using the same
TWI645973B Thinner and flexible polyimide substrate and method for manufacturing thereof
TW201914825A Multilayer graphene flexible printed circuit transfer printing method and graphene flexible printed circuit assembly capable of completely transferring a graphene film that has a plurality of graphene layers from a metal substrate to a flexible printed circuit board unit
TWI624563B Method for forming a metal layer on the surface of a photosensitive resin
TW201906101A Heat dissipation package structure
TWI618979B Thermally conductive polyimide substrate
TWI618980B Thermal conductive and photosensitive resin
TWI635139B Transparent photosensitive resin
TWI609897B Polyimide resin, thin film and method for manufacturing thereof
TW201823314A Composition and application of high temperature resistant proton exchange membrane material capable of improving the solubility of the film forming process, enhancing the heat resistance, mechanical strength and electrical conductivity of membrane layer
TWI600168B Laminate structure of thin film transistor
TW201736113A Flexible and transparent polyimide laminate and manufacturing method thereof