| # | Country | Total Patents | |
|---|---|---|---|
| #1 | United States | 8 | |
| #2 | Japan | 4 | |
| #3 | Taiwan | 1 |
| # | Industry | |
|---|---|---|
| #1 | Thermal processes | |
| #2 | Semiconductors | |
| #3 | Audio-visual technology | |
| #4 | Computer technology | |
| #5 | Electrical machinery and energy |
| # | Name | Total Patents |
|---|---|---|
| #1 | Yeh Yun-Yeu | 6 |
| #2 | Zeng Quan-Qi | 3 |
| #3 | Tseng Chuan-Chi | 3 |
| #4 | Chou Chun-Huang | 2 |
| #5 | Chan Sheng-Chin | 2 |
| #6 | Liu Chih Ming | 2 |
| #7 | Lai Yaw-Huey | 2 |
| #8 | Cui Ming-Quan | 2 |
| #9 | Wang Chien-Tung | 1 |
| #10 | Lin Bohong | 1 |
| Publication | Filing date | Title |
|---|---|---|
| US2017160018A1 | Heat pipe with fiber wick structure | |
| US2017363367A1 | Heat dissipation device | |
| US9627813B1 | Card connector with identification function | |
| US2017350657A1 | Heat spreader with a liquid-vapor separation structure | |
| TW201704711A | Fixture device for heat-dissipating module and heat-dissipating module having fixture device including an elongated body, at least two latch members, and an actuation bolt |