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Suzhou riyuexin semiconductor co ltd

Overview
  • Total Patents
    17
  • GoodIP Patent Rank
    165,155
About

Suzhou riyuexin semiconductor co ltd has a total of 17 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are MISPAK TECH CO LTD, HANRAHAN JOSEPH FRANCIS and SHIMU KK.

Patent filings in countries

World map showing Suzhou riyuexin semiconductor co ltds patent filings in countries
# Country Total Patents
#1 China 17

Patent filings per year

Chart showing Suzhou riyuexin semiconductor co ltds patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Guo Guiguan 11
#2 Wang Yu 4
#3 Li Weixian 2
#4 Li Rongzhe 2
#5 Chen Qian 2
#6 Wang Zhengyao 2
#7 Jin Yongbin 1
#8 Zhao Dongdong 1
#9 Yu Zhijun 1
#10 Li Songmao 1

Latest patents

Publication Filing date Title
CN106328620A Integrated circuit packaging body and manufacturing method thereof
CN105826211A Semiconductor product, and tool and method for manufacturing the semiconductor product
CN105428325A Preparation process for single-layer ultrathin substrate package structure with metal shielding layer and product of single-layer ultrathin substrate package structure
CN105261601A Double-layer package structure and manufacturing method thereof
CN104966703A Integrated circuit package and method of forming same
CN104659022A Wire-bonded shielding structure and preparation method thereof
CN104505361A Wafer transferring tool
CN104465596A Lead frame, semiconductor packaging body and manufacturing method thereof
CN104409446A Conformal shielding structure applying lead bonding, and manufacture process thereof
CN104091796A Electronic chip shielding layer structure
CN103681585A Lead frame, QFN (Quad Flat No Lead) packaging body, and method for forming QFN packaging body
CN103311160A Semiconductor element arrangement jig and operation method thereof
CN103258772A Heating seat and heating device of routing process
CN103050485A Package substrate structure
CN103050469A Outer-lead-free lead frame strip of semiconductor encapsulation structure
CN103050475A Anti-warp packaging substrate
CN103078041A LED (Light-Emitting Diode) encapsulation structure and manufacturing method thereof