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MISPAK TECH CO LTD

Overview
  • Total Patents
    18
  • GoodIP Patent Rank
    94,185
  • Filing trend
    ⇧ 100.0%
About

MISPAK TECH CO LTD has a total of 18 patent applications. It increased the IP activity by 100.0%. Its first patent ever was published in 2016. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are ADVANCED EPITAXY TECHNOLOGY IN, VISIC TECHNOLOGIES LTD and CPTF VISUAL DISPLAY FUZHOU LTD.

Patent filings in countries

World map showing MISPAK TECH CO LTDs patent filings in countries
# Country Total Patents
#1 China 18

Patent filings per year

Chart showing MISPAK TECH CO LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Chen Lingzhi 14
#2 Yu Kefeng 13
#3 Zhang Kai 13
#4 Wang Xinchao 9
#5 Zhou Jiawei 3
#6 Lin Yuntao 3
#7 Wang Jin 3
#8 Ren Jiao 3
#9 Zhang Lidong 3
#10 Zou Jian'An 3

Latest patents

Publication Filing date Title
CN109509734A Subtractive process pre-packaged lead frame structure and its manufacturing method
CN109192714A A kind of frame base and its manufacturing method for plating shield
CN108962866A A kind of pre-packaged frame structure and preparation method thereof
CN109166807A The manufacturing method of novel fan-out package structure
CN106783794A It is pre-packaged without wire electrodepositable lead-frame packages structure and its manufacture method
CN106876360A The pre-packaged wettable lead frame structure in many sides and its manufacture method
CN106373931A High-density chip re-wiring package structure and fabrication method thereof
CN106158811A A kind of multi-layer support structure and manufacture method thereof
CN106129017A Two-way integrated embedded type POP encapsulating structure and preparation method thereof
CN106098643A Two-way integrated chip reroutes embedded type board structure and preparation method thereof
CN106129016A Two-way integrated embedded type chip reroutes POP encapsulating structure and preparation method thereof
CN106129052A Two-way integrated embedded type chip reroutes board structure and preparation method thereof
CN106098681A Two-way integrated embedded type board structure and preparation method thereof
CN106129022A Two-way integrated chip reroutes embedded type POP encapsulating structure and preparation method thereof
CN106129036A A kind of plastic type buries appearance metal framework structure and process thereof
CN106024750A Metal lead frame structure with low test cost and manufacturing method thereof
CN106098570A Cavity type plastic packaged module structure and manufacture method thereof
CN105932006A Wettable lead frame structure with pre-encapsulated side and manufacturing method of wettable lead frame structure