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BATHAN HENRY DESCALZO

Overview
  • Total Patents
    18
About

BATHAN HENRY DESCALZO has a total of 18 patent applications. Its first patent ever was published in 2007. It filed its patents most often in United States. Its main competitors in its focus markets semiconductors are OMMIC, IPENVAL CONSULTANT INC and JINGYUAN PHOTOELECTRIC CO LTD.

Patent filings in countries

World map showing BATHAN HENRY DESCALZOs patent filings in countries
# Country Total Patents
#1 United States 18

Patent filings per year

Chart showing BATHAN HENRY DESCALZOs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Bathan Henry Descalzo 18
#2 Camacho Zigmund Ramirez 17
#3 Tay Lionel Chien Hui 7
#4 Pisigan Jairus Legaspi 5
#5 Espiritu Emmanuel 5
#6 Caparas Jose Alvin 3
#7 Punzalan Jeffrey D 3
#8 Trasporto Arnel Senosa 3
#9 Carson Flynn 1
#10 Shim Il Kwon 1

Latest patents

Publication Filing date Title
US2014048919A1 Integrated circuit packaging system with array contacts and method of manufacture thereof
US2012241931A1 Integrated circuit packaging system with interconnects and method of manufacture thereof
US2012241983A1 Integrated circuit packaging system with a flip chip and method of manufacture thereof
US8193037B1 Integrated circuit packaging system with pad connection and method of manufacture thereof
US2011079888A1 Integrated circuit packaging system with protective coating and method of manufacture thereof
US2011079886A1 Integrated circuit packaging system with pad connection and method of manufacture thereof
US2011108966A1 Integrated circuit packaging system with concave trenches and method of manufacture thereof
US2011140287A1 Integrated circuit packaging system with bond wire pads and method of manufacture thereof
US2010320586A1 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
US2010123229A1 Integrated circuit packaging system with plated pad and method of manufacture thereof
US2010001384A1 Integrated circuit package system with lead-frame paddle scheme for single axis partial saw isolation
US2009230517A1 Integrated circuit package system with integration port
US2009001563A1 Integrated circuit package in package system with adhesiveless package attach
US2008272479A1 Integrated circuit package system with device cavity
US2008237816A1 Integrated circuit package system with encapsulating features