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HONGQISHENG PREC ELECTRONIC QINHUANGDAO CO LTD

Overview
  • Total Patents
    43
  • GoodIP Patent Rank
    201,183
About

HONGQISHENG PREC ELECTRONIC QINHUANGDAO CO LTD has a total of 43 patent applications. Its first patent ever was published in 2012. It filed its patents most often in China. Its main competitors in its focus markets semiconductors, audio-visual technology and machines are SHANGHAI LANPEI NEW MATERIAL TECHNOLOGY CO LTD, KONDO HITOSHI and STAKTEK GROUP LP.

Patent filings in countries

World map showing HONGQISHENG PREC ELECTRONIC QINHUANGDAO CO LTDs patent filings in countries
# Country Total Patents
#1 China 43

Patent filings per year

Chart showing HONGQISHENG PREC ELECTRONIC QINHUANGDAO CO LTDs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Hu Wenhong 13
#2 Xu Shibin 6
#3 Zhou Edong 5
#4 Li Taiqiu 3
#5 Chen Jianzhi 3
#6 Luo Wenlun 3
#7 Yu Longxia 3
#8 Li Weixiang 2
#9 Liu Jinpeng 2
#10 Lin Zhaowen 2

Latest patents

Publication Filing date Title
CN107820362A Hollow out flexible circuit board and preparation method
CN107812746A Automatic water-replenishing device
CN107404804A Circuit board and preparation method thereof
CN107404797A Multilayer circuit board with segment difference structure and preparation method thereof
CN104640376A Circuit board plug hole forming method
CN104425286A IC carrier plate, semiconductor device having the same and manufacturing method of the IC carrier plate
CN104427783A A flexible printed circuit board having golden fingers and manufacturing method thereof
CN104299919A Coreless package structure and method for manufacturing the same
CN104254191A Coreless layer packaging substrate and manufacturing method thereof
CN104254197A Circuit board and manufacturing method thereof
CN104254213A Multi-layer circuit board and manufacturing method thereof
CN104183508A Manufacturing method of semiconductor device
CN104112673A Chip packaging base board and manufacturing method thereof
CN104105337A Circuit board with high-density circuits and method for manufacturing the circuit board
CN104103531A Packaging structure and manufacturing method thereof
CN103929895A Circuit board with embedded element and manufacturing method of circuit board with embedded element and packaging structure of circuit board with embedded element
CN103904050A Package substrate, manufacturing method of package substrate and packaging structure
CN103906370A Chip packaging structure, circuit board having embedded component and manufacturing method thereof
CN103857197A Circuit board and manufacturing method of circuit board
CN103857207A Circuit board and manufacturing method thereof