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Method for manufacturing printed circuit board assembly
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Charge transfer load sensor
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Programmable capacitive horn switch
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Metal-film laminate resistant to delamination
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Printed circuit assembly and method of manufacture therefor
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Method of manufacturing a multilayer electronic circuit
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Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
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Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer
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Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
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Printed wiring board with photoimageable dielectric base substrate and method of manufacture therefor
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Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
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Metallized laminate material having ordered distribution of conductive through holes
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Flexible multilayer printed circuit boards and methods of manufacture
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Rigid-flex board with anisotropic interconnect and method of manufacture
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Method for electrically and mechanically connecting at least two conductive layers
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Method of preparing adherent/coherent amorphous fluorocarbon coatings
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Direct application of unpackaged integrated circuit to flexible printed circuit
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Impedance controlled flexible circuits with fold-over shields
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Surface mounted components on flex circuits
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Metal-film laminate resistant to delamination
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