DIE TECH INC has a total of 13 patent applications. Its first patent ever was published in 1989. It filed its patents most often in United States, EPO (European Patent Office) and Australia. Its main competitors in its focus markets audio-visual technology, machines and electrical machinery and energy are LUC TECHNOLOGIES LTD, TONG HSING ELECTRIC IND LTD and INFOTECH AG.
# | Country | Total Patents | |
---|---|---|---|
#1 | United States | 9 | |
#2 | EPO (European Patent Office) | 2 | |
#3 | Australia | 1 | |
#4 | WIPO (World Intellectual Property Organization) | 1 |
# | Industry | |
---|---|---|
#1 | Audio-visual technology | |
#2 | Machines | |
#3 | Electrical machinery and energy | |
#4 | Semiconductors |
# | Technology | |
---|---|---|
#1 | Casings and printed circuits | |
#2 | Electrically-conductive connections | |
#3 | Unspecified technologies | |
#4 | Semiconductor devices | |
#5 | Working stone |
# | Name | Total Patents |
---|---|---|
#1 | Dennis Richard K | 11 |
#2 | Archer David L | 2 |
#3 | Correll Thomas R | 2 |
#4 | Abel Baron E | 2 |
#5 | Riddle James A | 1 |
#6 | Myers Wade D | 1 |
Publication | Filing date | Title |
---|---|---|
AU4356100A | Edge clip terminal and method | |
US5333375A | Substrate lead strip mounting machine and method | |
US5411420A | Solder terminal strip | |
US5253415A | Method of making an integrated circuit substrate lead assembly | |
US5136779A | Method of mounting lead frame on substrate | |
US5133491A | Substrate breaker | |
US5057901A | Lead frame for semi-conductor device | |
US5015206A | Solder terminal | |
US4900279A | Solder terminal |