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SHANGHAI MICROELECTRONICS EQUI

Overview
  • Total Patents
    1,559
  • GoodIP Patent Rank
    3,476
  • Filing trend
    ⇩ 100.0%
About

SHANGHAI MICROELECTRONICS EQUI has a total of 1,559 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2004. It filed its patents most often in China, WIPO (World Intellectual Property Organization) and Taiwan. Its main competitors in its focus markets optics, semiconductors and measurement are SHANGHAI MICRO ELECTRONICS EQUIPMENT (GROUP) CO LTD, SHANGHAI MICRO ELECTRONICS EQUIPMENT(GROUP) CO LTD and AUROS TECH INC.

Patent filings per year

Chart showing SHANGHAI MICROELECTRONICS EQUIs patent filings per year from 1900 to 2020

Top inventors

# Name Total Patents
#1 Wang Fan 66
#2 Chen Feibiao 50
#3 Chen Qingsheng 46
#4 Wu Liwei 44
#5 Zhang Jun 43
#6 Yonghui Chen 40
#7 Li Yunfeng 39
#8 Haijun Song 38
#9 Li Zhidan 33
#10 Wu Fei 33

Latest patents

Publication Filing date Title
US2018195971A1 Apparatus and Method for 3D Surface Inspection
CN106933060A A kind of prism rotation regulating mechanism and exposure system of photo-etching machine and litho machine
CN107134427A Chip bonding device and method
CN107134421A A kind of automated bonding equipment
CN107134423A Flip-chip bonding apparatus and its bonding method
CN107134418A Flip-chip bonding apparatus and bonding method
CN107134419A Flip-chip bonding apparatus and its bonding method
CN107134420A Chip bonding device and method
CN107134446A A kind of chip bonding device and bonding method
CN107092166A Exposure system, exposure device and exposure method
CN107024176A Displacement measurement system and method based on diffraction grating
CN107024185A A kind of basal surface type measuring method and measurement apparatus
CN107024274A A kind of analyzing method suitable for light orientation equipment
CN106997152A Scanning reflection mirror monitoring system and method, focusing and leveling system
CN106997150A It is a kind of to reduce the method and its application of lithographic objective pressure-sensitivity
CN106997929A A kind of plesiochronous package system of double-sided laser and method for packing
CN106997159A Wafer pre-alignment mechanism, exposure device and exposure method
CN106997151A Hot spot layout structure, surface shape measurement method and exposure field control value calculating method
CN106932882A A kind of positioning and mounting structure of ellipsoidal reflector
CN106933057A splicing objective temperature control device and splicing objective temperature control method