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GREAT TEAM BACKEND FOUNDRY LTD

Overview
  • Total Patents
    35
  • GoodIP Patent Rank
    64,303
  • Filing trend
    ⇩ 100.0%
About

GREAT TEAM BACKEND FOUNDRY LTD has a total of 35 patent applications. It decreased the IP activity by 100.0%. Its first patent ever was published in 2011. It filed its patents most often in China. Its main competitors in its focus markets semiconductors are KOVAR JIRI, LAVROV VLADIMIR A and SAGE WISE 66 PTY LTD.

Patent filings in countries

World map showing GREAT TEAM BACKEND FOUNDRY LTDs patent filings in countries
# Country Total Patents
#1 China 35

Patent filings per year

Chart showing GREAT TEAM BACKEND FOUNDRY LTDs patent filings per year from 1900 to 2020

Focus industries

# Industry
#1 Semiconductors

Focus technologies

# Technology
#1 Semiconductor devices

Top inventors

# Name Total Patents
#1 Cao Zhou 29
#2 Xu Zhenjie 11
#3 Ao Libo 10
#4 Huang Yuanwei 5
#5 Li Pengzhao 4
#6 Jiang Wei 3
#7 Tao Shaoyong 3
#8 Sang Linbo 2
#9 He Jinwen 2
#10 Han Fubin 2

Latest patents

Publication Filing date Title
CN106876344A A kind of semiconductor package and method for packing
CN105428330A Semiconductor device and manufacturing method thereof
CN105374788A Stacked flip chip packaging structure and manufacture method thereof
CN105244331A Chip package structure
CN105355606A Novel system-in-package
CN105304504A Manufacturing method for substrate used for semiconductor device
CN105006464A Leading wire frame
CN105161428A Method for welding chip through printing bonding material
CN104900545A Semiconductor encapsulation method
CN104867899A Lead wire frame realizing high-density pins
CN104617002A Semiconductor packaging method and structure
CN104600050A Lead frame and chip package thereof
CN104600049A Lead frame and chip packing body thereof
CN104576407A Lead frame pipe pin end face tinned packaging method and packaging structure
CN104599941A Method for reducing soldering rotation of flip chip
CN104600061A Stack-based 3D packaging structure of semiconductor chip
CN104600048A Semiconductor packaging structure and method
CN104599983A Glue overflowing preventing type packaging method of semiconductor device
CN104600042A Semiconductor device
CN104600041A Packaging structure and method of double-sided radiating semiconductor