SENCIO B V has a total of 27 patent applications. It decreased the IP activity by 77.0%. Its first patent ever was published in 2002. It filed its patents most often in EPO (European Patent Office), Netherlands and United States. Its main competitors in its focus markets semiconductors, measurement and machines are BRUNNBAUER MARKUS, ASE ASSEMBLY AND TEST SHANGHAI LTD and TSAI CHUNG CHE.
# | Country | Total Patents | |
---|---|---|---|
#1 | EPO (European Patent Office) | 7 | |
#2 | Netherlands | 6 | |
#3 | United States | 6 | |
#4 | WIPO (World Intellectual Property Organization) | 4 | |
#5 | China | 3 | |
#6 | Australia | 1 |
# | Industry | |
---|---|---|
#1 | Semiconductors | |
#2 | Measurement | |
#3 | Machines | |
#4 | Optics |
# | Name | Total Patents |
---|---|---|
#1 | Raben Jurgen Leonardus Theodorus Maria | 11 |
#2 | Van Dommelen Ignatius Josephus | 11 |
#3 | Jansen Johannes Stephanus | 5 |
#4 | Ignatius Josephus Van Dommelen | 3 |
#5 | Pleumeekers Johannes Mathias Nicolaas | 2 |
#6 | Johannes Mathias Nicolaas Pleumeekers | 1 |
#7 | Jurgen Leonardus Theodorus Maria Raben | 1 |
#8 | Raben Leonardus Theodorus Maria | 1 |
Publication | Filing date | Title |
---|---|---|
NL2022241B1 | Laser chip package | |
NL2020901B1 | A sensor package and a method of manufacturing a sensor package | |
AU2017266836A1 | Integrated circuit package and method of manufacturing the same | |
NL2017885B1 | Sensor package and method of manufacturing the same | |
CN105849896A | Integrated circuit package | |
NL2013191B1 | Integrated circuit package moulding method and mould. | |
NL2012304C2 | Pressure sensing device and method for manufacturing such a device. | |
NL2011638C2 | Integrated circuit package. | |
US2009206467A1 | Integrated circuit package | |
EP2051298A1 | Integrated Circuit Package | |
EP1430522A1 | Method for encapsulating a chip |